SICE 2026杭州国际半导体与集成电路产业创新展览会

发布日期： 2025-10-10 15:15:58 阅读量： 3

SICE 2026

2026杭州国际半导体与集成电路产业创新展览会

Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition 2026

展览时间：

2026年05月14日-16日

May 14-16, 2026

展览地点：

杭州大会展中心-浙江

Hangzhou Grand Convention and Exhibition Center-Zhejiang

展会介绍|Exhibition Background

半导体与集成电路产业是代表未来的重要引擎性、支撑性、标志性蓝海产业。随着全球数字化转型的加速，半导体与集成电路产业的重要性日益凸显，浙江省半导体与集成电路产业现已建立起涵盖设计、材料、装备、制造、封装测试等环节的完整产业链，形成了以杭、绍、甬、嘉为核心的环杭州湾模拟芯片与功率器件特色产业集群和以湖、金、衢、丽为核心的半导体材料支撑产业集群。作为国家集成电路产业设计的重要基地，杭州市政府高度重视集成电路产业的发展，先后出台了《杭州市进一步鼓励集成电路产业加快发展的专项政策》、《关于促进集成电路产业高质量发展的实施意见》以及《关于推动经济高质量发展的若干政策》财政补贴、税收优惠、人才引进和平台建设一系列专项政策发展，提出打造长三角集成电路核心城市，会同宁波市、绍兴市、嘉兴市协同打造环杭州湾集成电路核心产业集聚区。到2025年，杭州集成电路产业规模实现800亿元、冲刺1000亿元，年均增长20%的目标，在产业生态建设方面，杭州构建起覆盖“芯片设计-基础材料-集成电路制造-规模化应用” 的完整产业链，集聚上下游产业形成以晶圆制造为核心的产业集群，在设计制造、化合物半导体、半导体核心材料、关键设备及零部件等领域培育一批“专精特新”中小企业，其产品广泛服务于消费电子、工业控制、汽车电子等多个领域，为行业发展提供了重要力量。

The semiconductor and integrated circuit (IC) industry is a sector characterized by strategic, fundamental, and pioneering nature, leading the way toward the future. With the acceleration of global digital transformation, it is of great significance for the semiconductor and IC industry. Zhejiang has established a complete industrial chain covering design, materials, equipment, manufacturing, and packaging and testing. It has formed a specialized industrial cluster for analog chips and power devices centered around Hangzhou, Shaoxing, Ningbo, and Jiaxing in the Hangzhou Bay area, along with a semiconductor materials-supported industrial cluster centered around Huzhou, Jinhua, Quzhou, and Lishui. As an important hub for the national IC design industry, the Hangzhou Municipal Government places great emphasis on the development of the IC. It has successively introduced a series of special policies, including the Special Policies for Further Encouraging the Accelerated Development of the IC Industry in Hangzhou, the Implementation Opinions on Promoting the High-Quality Development of the IC Industry, and the Policies on Promoting High-Quality Economic Development, covering financial subsidies, tax incentives, talent introduction, and platform development. The city aims to build itself into a core IC hub in the Yangtze River Delta region, in collaboration with Ningbo, Shaoxing and Jiaxing, jointly develop a core integrated circuit industrial cluster around the Hangzhou Bay area. By 2025, Hangzhou’s integrated circuit industry will reach a scale of 80 billion yuan, striving toward 100 billion yuan, with an annual growth target of 20%. In terms of construction of the industrial ecosystem, Hangzhou has established a complete industry chain covering chip design, basic materials, integrated circuit manufacturing, and large-scale applications, bringing together upstream and downstream enterprises to form an industry cluster centered on wafer manufacturing. Meanwhile, the city has nurtured a group of specialized and innovative small and medium-sized enterprises in areas such as design and manufacturing, compound semiconductors, core semiconductor materials, and key equipment and components, which widely applied in consumer electronics, industrial control and automotive electronics, contributed to the advancement of the industry.

新的机遇|New Opportunities

为给更多的半导体与集成电路企业搭建一个集产品展示、贸易洽谈、技术交流、投资合作于一体的国际化平台。在上级主管部门的指导下，高登会展联合相关主管单位将于2026年05月14日-16日在杭州大会展中心召开“2026杭州国际半导体与集成电路产业创新展览会”，展会以“链接芯生态，智造新机遇”为主题，展会总规划面积为3万平米，展品范围涵盖集成电路设计、IP、EDA、制造、封装测试、设备制造、半导体材料、设计服务、芯片应用等产品和技术。本届展会将汇聚全球半导体与集成电路行业尖端技术、前沿产品，从芯片设计到集成电路解决方案，全方位展示半导体与集成电路产业的创新力量。通过展览与论坛相结合形式，从不同视角全方位展示中国（尤其是长三角地区）半导体与集成电路产业的创新实力与发展成果，分享产业前沿动态，汇聚产业创新人才，促进技术交流合作，推动产业生态构建，进一步促进半导体与集成电路创新链产业链供应链的深度融合，助力我国半导体与集成电路产业高质量发展。

To provide more semiconductor and IC companies with an international platform that integrates product display, trade negotiation, technical exchange and investment cooperation. Under the guidance of the competent authorities, Golden Group, in collaboration with relevant administrative units, will hold the “Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition 2026” from May 14 to 16, 2026 at the Hangzhou Grand Convention and Exhibition Center. With a total planned area of 30,000 square meters, the exhibition takes “Connecting the Chip Ecosystem, Creating New Opportunities” as its theme. The exhibits covers a wide range of products and technologies, including integrated circuit design, IP, EDA, manufacturing, packaging and testing, equipment manufacturing, semiconductor materials, design services, and chip applications. It will bring together cutting-edge technologies and frontier products from the global semiconductor and integrated circuit industry, showcasing the full spectrum of innovation in the sector from chip design to integrated circuit solutions. Combined with exhibition and forums, the event will comprehensively showcase the innovative strength and development achievements of China’s semiconductor and IC industry particularly in the Yangtze River Delta region from multiple perspectives. It aims to share cutting-edge industry trends, gather together innovative talent, promote technological exchange and collaboration, foster the construction of an industrial ecosystem, and further drive the deep integration of the innovation, industrial and supply chains, which contributed to the high-quality development of China’s semiconductor and IC industry.

同期活动|Concurrent Activities

展会同期将举办半导体与集成电路产业发展高峰论坛、技术交流会、投融资对接会、首发首秀等多场专业活动，集聚顶尖专家、企业高管与投资机构，深度探讨全球半导体和集成电路发展趋势与关键应用场景。期间，多场半导体制造、集成电路、电子电力、电子制造、显示制造以及汽车、信息通信、消费电子等领域的供需对接会将作为展会的最大的亮点，对接会以采购商与参展商对一面对面交流形式进行，通过交流对接完成产品细节的交流与信息的收集，旨在推动产业链上下游企业之间的精准商务合作。

During the exhibition, there are a series of activities held, including the Semiconductor and Integrated Circuit Industry Development Summit, Technology Exchange Meetings, Investment and Financing Matchmaking Meetings, Product Launches and Debuts. It will bring together top experts, corporate executives, and investment institutions to engage in in-depth discussions on development trends and key application scenarios of global semiconductor and integrated circuit. Multiple supply-and-demand matchmaking meetings covering semiconductors, integrated circuits, electronic power, electronics manufacturing, display manufacturing, as well as automotive, information and communications, and consumer electronics will serve as a major highlight of the exhibition. The matchmaking meetings take the form of face-to-face interactions between buyers and exhibitors to discuss product details and gather information, aiming to facilitate precise business cooperation among upstream and downstream enterprises in the industry chain.

展品大类|Major Exhibits

• IC设计/芯片与应用：IC及相关电子产品设计、EDA、AI算力芯片、存储芯片、汽车芯片、智能家电芯片、人工智能芯片及物联网、人工智能、汽车电子、智慧城市、智能终端、健康医疗等产品；

IC Design / Chips and Applications: IC and related electronic product design, EDA, AI computing power chips, memory chips, automotive chips, smart home appliance chips, artificial intelligence chips, as well as products in the fields of the Internet of Things (IoT), AI, automotive electronics, smart cities, smart terminals, healthcare, etc.

• IC制造：半导体晶圆制造、半导体封装与测试技术及产品；

IC Manufacturing: Semiconductor wafer fabrication, semiconductor packaging, and testing technologies and products, etc.

• 先进封装：倒装、凸点、晶圆级封装、2.5D/3D先进封装(TSV及TGV))、扇出型晶圆级封装等设计、材料、测试、设备等；

Advanced Packaging: Flip-chip, bumping, wafer-level packaging, 2.5D/3D advanced packaging (TSV and TGV), fan-out wafer-level packaging, as well as related design, materials, testing, and equipment, etc.

• 晶圆设备/封测设备：晶圆加工过程中所需的各种精密设备及半导体封装设备、半导体测试设备、IC测试仪器、先进封装工艺（如SiP、3D封装）设备、功率器件设备等；

Wafer Equipment / Packaging and Testing Equipment: Precision equipment and semiconductor packaging equipment required for wafer processing, semiconductor testing equipment, IC testing instruments, equipment for advanced packaging processes (such as SiP and 3D packaging), and power device equipment, etc.

• 化合物半导体及功率器件：化合物半导体材料（如GaN、SiC等）及其相关产品，包括功率器件、射频器件及上游设备、材料等；

Compound Semiconductors and Power Devices: Compound semiconductor materials (such as GaN, SiC, etc.) and related products, including power devices, RF devices, as well as upstream equipment and materials, etc.

• 半导体材料：单晶硅、硅片及硅基材料、抛光垫、掩膜版、溅射靶材、抛光液、刻蚀溶液、陶瓷封装材料、键合丝、引线框架、封装基板、光刻胶、薄膜沉积材料、特种气体、超纯水、塑封材料、高性能塑料等；

Semiconductor Materials: Monocrystalline silicon, wafers and silicon-based materials, polishing pads, photomasks, sputtering targets, polishing slurries, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin-film deposition materials, specialty gases, ultrapure water, molding compounds, high-performance plastics, etc.

• 半导体核心零部件：机器视觉、传感器、密封圈、精密轴承、金属零部件、Valve阀、硅/SiC件、Robots、石英件、过滤器、射频电源、陶瓷件、ESC静电吸盘、压力Gauge、泵、MFC流量计、步进马达、运动控制、伺服电机、直线模组、无尘拖链、封装模具、制冷设备、感应加热器等；

Core Semiconductor Components: Machine vision systems, sensors, sealing rings, precision bearings, metal components, valves, silicon/SiC components, robots, quartz components, filters, RF power supplies, ceramic components, ESC electrostatic chucks, pressure gauges, pumps, MFC flow controllers, stepper motors, motion control systems, servo motors, linear modules, cleanroom drag chains, packaging molds, cooling equipment, induction heaters, etc.

• AI算力：AI芯片、服务器、交换器、电源、液冷温控等；

AI Computing Power: AI chips, servers, switches, power supplies, liquid cooling and temperature control systems, etc.

• 配套设施与服务：支持产品/无尘室、一般商业服务/咨询、销售及服务、标准与其他。

Supporting Facilities and Services: Product support/cleanrooms, general business services/consulting, sales and services, standards, etc.

展区设置|Exhibition Areas

1、IC设计/芯片与应用IC Design / Chips and Applications Pavilion

2、IC制造IC Manufacturing Pavilion

3、晶圆设备Wafer Equipment Pavilion

4、封测设备Packaging and Testing Equipment Pavilion

5、核心零部件及材料Core Components and Materials Pavilion

6、化合物半导体及功率器件Compound Semiconductors and Power Devices Pavilion

7、AI算力AI Computing Power Pavilion

8、配套设施与服务Supporting Facilities and Services Pavilion

9、各省市地方展团与区域集群Provincial and Municipal Pavilions & Regional Clusters Pavilion

聚焦“高端芯”与“国产替代”的最新突破，打造行业最前沿的技术展示平台。

Focusing on the latest breakthroughs in “high-end chips” and “domestic substitution,” the event strives to provide a cutting-edge platform for showcasing industry-leading technologies.

观众组织|Target Audiences

本次展会将全力邀请全球半导体、集成电路、电子电力、电子制造、显示制造以及汽车、航空航天、医疗卫生、信息通信、消费电子等领域专业人士齐聚杭州，共探前沿科技，共商合作大计，携手解码产业新生态，合力共筑开放、协同、韧性的全球半导体与集成电路产业“芯”未来。

It will attract professionals from around the world in semiconductors, IC, electronic power, electronics manufacturing, display manufacturing, as well as automotive, aerospace, healthcare, information and communications, and consumer electronics to participate in the exhibition. The event provides an efficient platform for participants to explore cutting-edge technologies, discuss collaborative strategies, jointly decode the new industrial ecosystem, and work together to build an open, collaborative, and resilient core future for the global semiconductor and IC industry.

预定展位|Booth Reservation

请立即预定“SICE 2026”展位，越早预留位置越佳，争取最大曝光率，领先竞争对手，开拓无限商机。

Your timely reservation will allow us to preassign exhibit space. Requests for exhibit space will be accepted on a “first come, first served” basis.

如欲预订“SICE 2026”采购交易会展位，或了解更多信息，请发电子邮件至1766414942@qq.com 。或通过以下联络方法，预订展位。

To reserve the booth of “SICE 2026” or learn more information, please contact:

电话/ Tel : 15618977632

E-mail:1766414942@qq.com

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SICE 2026杭州国际半导体与集成电路产业创新展览会

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SICE 2026杭州国际半导体与集成电路产业创新展览会